DL QCT1255 T R7 PRO 8700G 16 512 W11P
5.876 74 RON
(TVA inclus)
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DL QCT1255 T R7 PRO 8700G 16 512 W11P
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Detalii
SKU
BTO524_QCT1255_EMEA
Categorii
Brand
Product colour
Black
Ethernet LAN
Yes
DisplayPorts quantity
1
Cables included
AC
Ethernet LAN (RJ-45) ports
1
Storage relative humidity (H-H)
5 - 95%
Operating relative humidity (H-H)
20 - 80%
On-board graphics card
Yes
Discrete graphics card
No
Discrete graphics card model
Not available
Combo headphone/mic port
Yes
HDMI ports quantity
1
HDMI version
2.1
Processor cores
8
Operating system architecture
64-bit
SSD capacity
512 GB
Total storage capacity
512 GB
Storage media
SSD
Optical drive type
No
Total SSDs capacity
512 GB
Number of SSDs installed
1
Processor threads
16
Memory layout (slots x size)
1 x 16 GB
Cable lock slot
Yes
Operating system installed
Windows 11 Pro
Trusted Platform Module (TPM)
Yes
On-board graphics card family
AMD Radeon
On-board GPU manufacturer
AMD
Neural processor unit (NPU)
AMD Ryzen AI
Processor manufacturer
AMD
Cable lock slot type
Kensington
USB 3.2 Gen 1 (3.1 Gen 1) Type-C ports quantity
1
Processor boost frequency
5.1 GHz
Trusted Platform Module (TPM) version
2.0
Audio system
High Definition Audio
Internal memory type
DDR5-SDRAM
Storage temperature (T-T)
-40 - 65 C
Trial software
McAfee Business Protection 1-year,Activate Your Microsoft 365 For A 30 Day Trial
Operating altitude
-15.2 - 3048 m
Non-operating altitude
-15.2 - 10668 m
DT-CPU
Intel
DT-Format
Tower
Ethernet LAN data rates
10,100,1000 Mbit/s
Maximum internal memory
64 GB
Processor cache type
L2 & L3
Processor generation
AMD Ryzen 8000 Series
Non-ECC
Yes
PowerShare
Yes
Audio Chip
Realtek ALC3204
Operating temperature (T-T)
10 - 35 C
Processor cache
24 MB
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity
3
On-board graphics card model
AMD Radeon 780M
NPU performance up to
16 TOPs
Chassis type
Tower
Display included
No
Product type
PC
USB 2.0 ports quantity
4
USB 3.2 Gen 2 (3.1 Gen 2) Type-A ports quantity
0
Thunderbolt 3 ports quantity
0
Number of processors installed
1
Processor frequency
4.2 GHz
USB 3.2 Gen 2 (3.1 Gen 2) Type-C ports quantity
0
Cabling technology
10/100/1000Base-T(X)
Memory slots
2x DIMM
PAIA version
GaBi version 1, 2024
Number of USB ports with PowerShare support
2
Model-procesor
AMD-RYZEN7
Memory data transfer rate
4800 MT/s
Operating vibration
0.26 G
Non-operating vibration
1.37 G
Non-operating shock
105 G
Operating shock
40 G
Power supply input voltage
90 - 264 V
Depth
293 mm
DisplayPort version
1.4a
Power supply input frequency
47/63 Hz
Width
154 mm
Height
324.3 mm
Total carbon footprint (kg of CO2e)
196
Carbon emissions, manufacturing (kg of CO2e)
106.82
Carbon emissions, logistics (kg of CO2e)
12.74
Carbon emissions, energy usage (kg of CO2e)
68.6
Carbon emissions, end-of-life (kg of CO2e)
7.84
Wi-FI
No
Motherboard chipset
AMD PRO 665
Processor model
8700G
Processor family
AMD Ryzen™ 7 PRO
Doesn't contain
PVC/BFR
Box contents
System Power Cord C13
Weight
6.76 kg